Based on the low-power Silvermont microarchitecture, this product family extends the scalability of Intel® architecture into smaller footprints, dense communicationss, and intelligent systems applications. This product family offers a range of multi-core processing capabilities (from two cores to eight cores) and features high levels of I/O and acceleration integration, resulting in a scalable, single-chip system-on-chip (SoC).
Based on the 22-nanometer process technology with 3D tri-gate transistors, the product family provides optimal performance per watt, addressing the needs of thermally constrained solutions, such as entry to midrange branch office routers, security appliances, network access, communications servers, small cells, control plane processing, and storage.
Pin-to-pin compatible, this product family allows developers to scale platforms seamlessly with design reuse. A range of thermal design power (TDP) from 7 to 20 watts supports energy-efficient network designs, including fanless embedded designs.
When paired with the Intel® Data Plane Development Kit (Intel® DPDK), this platform improves packet processing speeds to handle increased network traffic data rates and associated control and signaling infrastructure requirements.
Explore in-depth documentation, tools, and resources for Intel-powered embedded designs and Internet of Things applications.
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