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Intel® Customer Manufacturing Enabling Guide

Purpose of the Intel® Customer Manufacturing Enabling guide

The Intel® Customer Manufacturing Enabling guide serves as a data reference for customers using Intel® components in their products. Each chapter provides information with respect to a certain aspect of the use or characteristics of Intel components.

The information provided is meant to be generic in nature. Product-specific packaging information can be found in the product's technical documents. To learn more about specific Intel® products click here.

SMT board assembly recommendations
Suggested process parameters for Pb-free SMT board assembly reflow and rework.

An overview of electrostatic discharge and electrical overstress.

Board Flexure Initiative (BFI)
BFI definition, detection methods, and strategies to minimize effects.

Additional information sources
A reference to more detailed information on the topics covered in this Manufacturing Enabling Guide available on the Intel Learning Network.