Demonstration of concept to bring the endcap to life using Intel embedded technology.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.
Ensure consistent quality and minimize accidents with handling recommendations and practices.
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.