Package / Module / PC Card Outlines and Dimensions
2
NG
Intel Product Identification Codes
8 0 3 8 6 S X 1 6 S X 3
8
7
Up to15 Alphanumeric Characters
For Device Types
Package Type
Up to 6 Alphanumeric Characters
to Show Customer-Specific
Requirements
A B C D DP E F FP FW
FV G GB GC K KA KD KU N NG P PA PD PE Q R S SB SM U X
– – – – – – – – –
– – – – – – – – – – – – – – – – – – – – – ...
Ceramic Pin Grid Array
Ceramic Land Grid Array
Ceramic Dual In-Line Package
Cerdip Dual In-Line Package
Cerdip Dual In-Line Package, 300 MIL
Thin Small Out-Line Package, Die Up
Thin Small Out-Line Package, Die Down
Plastic Flatpack Package
Plastic Ball Grid Array Die Up
1.27 mm Solder Ball Pitch
Plastic Pin Grid Array, Cavity Down, Staggered Pin
Micro Ball Grid Array
Single In-Line Leaded Memory Module
HL-PBGA-Thermally Enhanced, Plastic Ball Grid Array
Ceramic Pin Grid Array
Ceramic Pin Grid Array, Dual Cavity, Die Down
Plastic Quad Flatpack Package, Fine Pitch, Die Down
Plastic Quad Flatpack Package, Fine Pitch, Die Up
Plastic Leaded Chip Carrier
Plastic Quad Flatpack, Fine Pitch, Die Down with Heat Spreader
Plastic Dual In-Line Package
Small Out-Line "Gull-Wing" Package
Plastic Dual In-Line Package, 300 MIL
Small Out-Line "J"-Lead Package
Ceramic Quad Flatpack Package
Ceramic Leadless Chip Carrier
Quad Flatpack Package
Shrink Quad Flatpack Package
Single In-Line Leadless Memory Module
Plastic Dual In-Line Package, Shrink Dip
Unpackaged Devices
A I
L
Q
T
_ _ _
_
_
Indicates automotive operating temperature range.
Indicates industrial grade.
Indicates extended operating temperature range (-40˚C to +85˚C) express product with
160 ± 8 hrs. dynamic burn-in.
Indicates commercial temperature range (0˚C to +70˚C) express product with 160 ± 8 hrs.
dynamic burn-in.
Indicates extended temperature range (-40˚C to +85˚C) express product without burn-in.
A5581-02
1999 Packaging Databook
2-1
Package / Module / PC Card Outlines and Dimensions
2.1 2.1.1
Ceramic Side Braze Dual In-line Package
Symbol List for Ceramic Side Braze Dual In-Line Family
Letter or Description of Dimensions
Symbol α Angular spacing between minimum and maximum lead positions measured at the gauge
plane
A Distance from seating plane to highest point of body (lid)
A Distance between seating plane and base plane
1
A Distance from base plane to highest point of body (lid)
2
A Base body thickness
3
B Width of terminal leads
B Width of terminal lead shoulder which locates seating plane (standoff geometry optional)
1
C Thickness of terminal leads
D Largest overall package dimension of length
D A body length dimension, end lead center to end lead center
2
E Largest overall package width dimension outside of lead
E Body width dimensions not including leads
1
e Linear spacing between centerlines of body standoffs (terminal leads)
1
e Linear spacing of true minimum lead position center line to center line
A
e Linear spacing between true lead position outside of lead to outside of lead
B
L Distance from seating plane to end of lead
N The total number of potentially usable lead positions
S Distance from true position centerline of No. 1 lead position to the extremity of the body
S Distance from outer end lead edge positions to the extremity of the body
1
NOTES: 1. Controlling dimension: millimeter.
2. Dimension “e ” (“e”) is non-cumulative.
1
3. Seating plane (standoff) is defined
Read the full Package / Module / PC Card Outlines
and Dimensions.