Introduction To The Package Technology
As semiconductor devices become more complex they are being introduced into products that
cover the spectrum of the marketplace. Portability of computing and information management is
driving the reduction in size from desktop to laptop to notebook to palm top sized products. These
products, require lightweight small ...footprint integrated packaging.
The Tape Carrier Package (TCP) format is one way to meet the small outline and high leadcount
interconnection needs of high performance microprocessors. The TCP has been designed to offer
reduced pitch, thin package profiles, smaller footprint on the printed circuit board, without
compromising performance. Intel continues to provide packaging solutions which meet rigorous
criteria for quality and performance. The Tape Carrier Package is no exception. Key package
features include surface mount technology design, lead pitch of 0.25 mm, 48 mm tape format,
polyimide-up for pick and place, and slide carrier handling. Shipped flat in slide carriers, the leads
are designed to be formed into a “gull-wing” configuration and reflowed onto the PCB by one of
several methods. Intel has done extensive optimization of the hot bar reflow process and
suggestions for that process are included in this chapter. Satisfactory placement and rework
capability has been demonstrated by industry sources using the hot gas reflow process. Industry
data also exists which demonstrates process feasibility for laser reflow.
The TCP family has been characterized for thermal, electrical, and mechanical performance.
Component and system level thermal testing has shown the TCP package to be capable of meeting
system level thermal design needs. Additional potential board level enhancements have been
identified and characterized to provide the most flexible design choices. A full suite of component
and board level stress testing has been completed to ensure that the component meets Intel’s
reliability targets. Evaluations of solder joints by stress testing, lead stiffness studies, and finite
element modeling have demonstrated that the mounted component will meet field use conditions
and lifetimes. The TCP package is capable of meeting a wide variety of design and use
applications. Table 12-1 provides an overview of TCP package attributes.
Table 12-1. Plastic Package Attributes
Sq/Rect. Lead Pitch (mm)
Package Thickness (mm)
Max. Footprint (mm)
Tape Carrier Package (TCP) Attributes
0.25 0.75 0.5
TCP components are shipped flat in slide carriers to protect the leads.
The carriers are shipped in polyethylene sleeves which hold up to 50
Package Geometry And Materials
The TCP component consists of the device interconnected to 3 layer (carrier film, adhesive, and
metal) Tape Automated Bonding (TAB) tape. The tape carrier film is polyimide and an advanced
epoxy-based adhesive system is used. The interconnects are copper. The tape metallization,
including the Outer Lead Bond (OLB) area of the interconnections, is gold plated over a nickel
flash. The silicon chip and Inner Lead Bond (ILB) area is encapsulated with a high temperature
thermoset polymer coating. The backside of the
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