Niezbędne zasoby

Kolekcja produktów
Stan
Launched
Data rozpoczęcia
2017
Litografia
14 nm

Zasoby

Logic Elements (LE)
1679000
Adaptive Logic Modules (ALM)
569200
Adaptive Logic Module (ALM) Registers
2276800
Fabric and I/O Phase-Locked Loops (PLLs)
16
Maximum Embedded Memory
223.5 Mb
Maximum High Bandwidth Memory
16 GB
Digital Signal Processing (DSP) Blocks
3326
Digital Signal Processing (DSP) Format
Multiply and Accumulate, Variable Precision, Fixed Point (hard IP), Floating Point (hard IP)
Hard Memory Controllers
Tak
External Memory Interfaces (EMIF)
DDR, DDR2, DDR3, DDR4, HMC, MoSys, QDR II, QDR II+, RLDRAM II, RLDRAM 3

Dane techniczne I/O

Maximum User I/O Count
656
I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.2 V to 3.3V LVCMOS, SSTL, POD, HSTL, HSUL, Differential SSTL, Differential POD, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
312
Maximum Non-Return to Zero (NRZ) Transceivers
96
Maximum Non-Return to Zero (NRZ) Data Rate
28.9 Gbps
Maximum Pulse-Amplitude Modulation (PAM4) Transceivers
36
Maximum Pulse-Amplitude Modulation (PAM4) Data Rate
57.8 Gbps
Transceiver Protocol Hard IP
PCIe Gen3, 10/25/100G Ethernet

Technologie zaawansowane

Hyper-Registers
Tak
FPGA Bitstream Security
Tak

Dane techniczne pakietu

Package Options
F2597, F2912

Informacje dodatkowe

Adres URL dodatkowych informacji