Product Collection
Marketing Status
Launched
Launch Date
2017
Lithography
20 nm

Resources

Logic Elements (LE)
104000
Adaptive Logic Modules (ALM)
38000
Adaptive Logic Module (ALM) Registers
152000
Fabric and I/O Phase-Locked Loops (PLLs)
10
Maximum Embedded Memory
8.439 Mb
Digital Signal Processing (DSP) Blocks
125
Digital Signal Processing (DSP) Format
Multiply, Multiply and Accumulate, Variable Precision, Fixed Point (hard IP), Floating Point (hard IP)
Hard Memory Controllers
Yes
External Memory Interfaces (EMIF)
DDR3, DDR3L, LPDDR3

I/O Specifications

Maximum User I/O Count
284
I/O Standards Support
3.0 V LVTTL, 1.2 V to 3.0 V LVCMOS, SSTL, POD, HSTL, HSUL, Differential SSTL, Differential POD, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
118
Maximum Non-Return to Zero (NRZ) Transceivers
12
Maximum Non-Return to Zero (NRZ) Data Rate
12.5 Gbps
Transceiver Protocol Hard IP
PCIe Gen2

Advanced Technologies

FPGA Bitstream Security
Yes

Package Specifications

Package Options
U484, F672, F780

Supplemental Information