This presentation provides an introduction and overview of Low Temperature Soldering, a breakthrough technology for greener electronics that can enable faster technology scaling while reducing carbon emissions and electricity costs.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Improve manufacturing processes by enabling monitoring, faster adjustments, and predictive maintenance.
Bill Giard of Intel and Bryant Eadon of StrongArm discuss the drivers and barriers for hybrid cloud adoption.
See how Intel’s Corporate Quality Network (CQN) ensures only the highest-quality products go to market.