This presentation provides an introduction and overview of Low Temperature Soldering, a breakthrough technology for greener electronics that can enable faster technology scaling while reducing carbon emissions and electricity costs.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Guide to LGA1567 socket independent loading mechanism installation for minimized contact damage.
Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
Bill Giard of Intel and Bryant Eadon of StrongArm discuss the drivers and barriers for hybrid cloud adoption.