Intel® Customer Manufacturing Enabling Guide
Purpose of the Intel® Customer Manufacturing Enabling guide
The Intel® Customer Manufacturing Enabling guide serves as a data reference for customers using Intel® components in their products. Each chapter provides information with respect to a certain aspect of the use or characteristics of Intel components.
The information provided is meant to be generic in nature. Product-specific packaging information can be found in the product's technical documents. To learn more about specific Intel® products click here.
SMT board assembly recommendations
Suggested process parameters for Pb-free SMT board assembly reflow and rework.
ESD / EOS
An overview of electrostatic discharge and electrical overstress.
Board Flexure Initiative (BFI)
BFI definition, detection methods, and strategies to minimize effects.
Additional information sources
A reference to more detailed information on the topics covered in this Manufacturing Enabling Guide available on the Intel Learning Network.