Article ID: 000076702 Content Type: Troubleshooting Last Reviewed: 02/12/2018

Why does the substance with CAS number 25550-51-0 still exist in wafer-level chip scale packages (WLCSP) even though the Intel® FPGA REACH webpage states it is not present in Intel MAX® 10 FPGA WLCSP devices or packing/shipping material?

Environment

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Description

The substance with CAS number 25550-51-0 was used in Intel® MAX® 10  wafer-level chip scale package (WLCSP) before cure but its concentration after cured is less than 1%, and therefore it meets the REACH requirement.

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Intel® MAX® 10 FPGAs