Visible to Intel only — GUID: kbf1613252579488
Ixiasoft
1. List of Abbreviations
2. Introduction
3. Intel® Agilex™ FPGA Package Mechanical Design
4. Intel® Agilex™ FPGA Thermal Design Parameters
5. Thermal Design Process for Intel® Agilex™ Devices
6. Power and Thermal Calculator (PTC) for Intel® Agilex™ Devices
7. Example 2—Alternative Method of Analyzing Thermal Design
8. Document Revision History for AN 944: Thermal Modeling for Intel® Agilex™ FPGAs with the Intel® FPGA Power and Thermal Calculator
Visible to Intel only — GUID: kbf1613252579488
Ixiasoft
3.1. Intel® Agilex™ Physical Package Structure
Figure 1. Physical Package StructureThis is a typical package structure relevant to thermal analysis and as laid out in the compact thermal models. This package only shows the core fabric die and two transceiver dies.