AN 778: Intel® Stratix® 10 L-Tile/H-Tile Transceiver Usage

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ID 683086
Date 6/24/2022
Public
Document Table of Contents
Document Table of Contents x
1. Transceiver Layout 2. Tile Architecture Constraints 3. PCIe Guidelines 4. Document Revision History for AN 778: Intel® Stratix® 10 L-Tile/H-Tile Transceiver Usage
1. Transceiver Layout x
1.1. L-Tile and H-Tile Overview
1.1. L-Tile and H-Tile Overview x
1.1.1. PLLs 1.1.2. Transmitter Clock Network 1.1.3. GXT Clock Network 1.1.4. Calibration
1.1.1. PLLs x
1.1.1.1. ATX PLL 1.1.1.2. fPLL 1.1.1.3. CMU PLL
1.1.2. Transmitter Clock Network x
1.1.2.1. Bonded Transceiver Channels - Guidelines for VCCR_GXB and VCCT_GXB
2. Tile Architecture Constraints x
2.1. Transceiver Channel Placement 2.2. Unsupported Dynamic Reconfiguration Features 2.3. Intel® Stratix® 10 L-Tile Transceiver to H-Tile Transceiver Migration 2.4. Thermal Guidelines
2.1. Transceiver Channel Placement x
2.1.1. Possible Combinations of GX and GXT Channels 2.1.2. GX Channels 2.1.3. GXT Channels 2.1.4. Bonded Channel Placement with Data Rate Change 2.1.5. Reference Clock Guidelines for L-Tile and H-Tile 2.1.6. PLL Placement
2.1.1. Possible Combinations of GX and GXT Channels x
2.1.1.1. Possible Combinations of GX and GXT Channels in H-Tile 2.1.1.2. Possible Combinations of GX and GXT Channels in L-Tile
2.1.2. GX Channels x
2.1.2.1. Non-bonded GX Channels 2.1.2.2. Bonded GX Channels
2.1.6. PLL Placement x
2.1.6.1. ATX PLL – fPLL Spacing Requirements 2.1.6.2. ATX PLL Usage Model When Driving GXT Channels 2.1.6.3. Simplex Channel Merging 2.1.6.4. TX PLL Restrictions when Using PCIe*
3. PCIe Guidelines x
3.1. PCIe Hard IP 3.2. PHY Interface for PCIe Express (PIPE)
3.1. PCIe Hard IP x
3.1.1. Channel Placement for PCIe Hard IP 3.1.2. PLL Placement for PCIe Hard IP 3.1.3. Non-PCIe and PCIe Hard IP Channel Placement in L-Tile and H-Tile
3.2. PHY Interface for PCIe Express (PIPE) x
3.2.1. Channel Placement for PIPE 3.2.2. PLL Placement for PIPE 3.2.3. Non-PCIe and PCIe PIPE Channel Placement in H-Tile 3.2.4. Non-PCIe and PCIe PIPE Channel Placement in L-Tile
1. Transceiver Layout
2. Tile Architecture Constraints
3. PCIe Guidelines
4. Document Revision History for AN 778: Intel® Stratix® 10 L-Tile/H-Tile Transceiver Usage

2.1.4. Bonded Channel Placement with Data Rate Change

For L-tile and H-tile production devices, GXT, OTN or SDI channels that share a bank or a tile with bonded channels that need to change their data rate through dynamic reconfiguration may momentarily observe transmitter jitter increase or bit errors during the data rate change event of the bonded channels.

Avoid placing GXT channels in the same bank with bonded channels that need to change their data rates. Avoid placing OTN or SDI channels above 9 Gbps in the same bank with bonded channels, or in the same tile with more than four bonded channels that need to change their data rates during operation.

GXT, OTN or SDI channels sharing the same bank with non-bonded channels are not impacted as long as any of the GX, OTN, SDI, and the non-bonded channels in the same bank do not change data rates at the same time. The following figures show the channel placement recommendations for bonded channels with data rate change requirements.

Figure 26. Channel Placement for GXT Channels and Bonded Channels with Data Rate Change
Figure 27. Channel Placement for OTN or SDI channels > 9 Gbps and Bonded Channels with Data Rate Change
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