AN 778: Intel® Stratix® 10 L-Tile/H-Tile Transceiver Usage

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ID 683086
Date 6/24/2022
Public
Document Table of Contents
Document Table of Contents x
1. Transceiver Layout 2. Tile Architecture Constraints 3. PCIe Guidelines 4. Document Revision History for AN 778: Intel® Stratix® 10 L-Tile/H-Tile Transceiver Usage
1. Transceiver Layout x
1.1. L-Tile and H-Tile Overview
1.1. L-Tile and H-Tile Overview x
1.1.1. PLLs 1.1.2. Transmitter Clock Network 1.1.3. GXT Clock Network 1.1.4. Calibration
1.1.1. PLLs x
1.1.1.1. ATX PLL 1.1.1.2. fPLL 1.1.1.3. CMU PLL
1.1.2. Transmitter Clock Network x
1.1.2.1. Bonded Transceiver Channels - Guidelines for VCCR_GXB and VCCT_GXB
2. Tile Architecture Constraints x
2.1. Transceiver Channel Placement 2.2. Unsupported Dynamic Reconfiguration Features 2.3. Intel® Stratix® 10 L-Tile Transceiver to H-Tile Transceiver Migration 2.4. Thermal Guidelines
2.1. Transceiver Channel Placement x
2.1.1. Possible Combinations of GX and GXT Channels 2.1.2. GX Channels 2.1.3. GXT Channels 2.1.4. Bonded Channel Placement with Data Rate Change 2.1.5. Reference Clock Guidelines for L-Tile and H-Tile 2.1.6. PLL Placement
2.1.1. Possible Combinations of GX and GXT Channels x
2.1.1.1. Possible Combinations of GX and GXT Channels in H-Tile 2.1.1.2. Possible Combinations of GX and GXT Channels in L-Tile
2.1.2. GX Channels x
2.1.2.1. Non-bonded GX Channels 2.1.2.2. Bonded GX Channels
2.1.6. PLL Placement x
2.1.6.1. ATX PLL – fPLL Spacing Requirements 2.1.6.2. ATX PLL Usage Model When Driving GXT Channels 2.1.6.3. Simplex Channel Merging 2.1.6.4. TX PLL Restrictions when Using PCIe*
3. PCIe Guidelines x
3.1. PCIe Hard IP 3.2. PHY Interface for PCIe Express (PIPE)
3.1. PCIe Hard IP x
3.1.1. Channel Placement for PCIe Hard IP 3.1.2. PLL Placement for PCIe Hard IP 3.1.3. Non-PCIe and PCIe Hard IP Channel Placement in L-Tile and H-Tile
3.2. PHY Interface for PCIe Express (PIPE) x
3.2.1. Channel Placement for PIPE 3.2.2. PLL Placement for PIPE 3.2.3. Non-PCIe and PCIe PIPE Channel Placement in H-Tile 3.2.4. Non-PCIe and PCIe PIPE Channel Placement in L-Tile
1. Transceiver Layout
2. Tile Architecture Constraints
3. PCIe Guidelines
4. Document Revision History for AN 778: Intel® Stratix® 10 L-Tile/H-Tile Transceiver Usage

2.1.1.1. Possible Combinations of GX and GXT Channels in H-Tile

Note: Refer to protocol specification for IL. For example, for 28G, Backplane support is CEI 3.0 25GLR. Different rates are supported by different specifications.
Table 4.  Combination 1: 4 GXT and 2 GX Channels
Channel Type Number of Channels per Bank Channel Capability for H-Tile
Chip-to-Chip & Chip-to-Module Backplane
GX 2 12.5 Gbps N/A
GXT 3 4 28.3 Gbps 28.3 Gbps
Figure 11. Example Combination 1: 4 GXT and 2 GX Channels
Table 5.  Combination 2: 3 GXT and 3 GX Channels
Channel Type Number of Channels per Bank Channel Capability for H-Tile
Chip-to-Chip & Chip-to-Module Backplane
GX 3 12.5 Gbps N/A
GXT 3 3 28.3 Gbps 28.3 Gbps
Figure 12. Example Combination 2: 3 GXT and 3 GX Channels
Table 6.  Combination 3: 2 GXT and 4 GX Channels
Channel Type Number of Channels per Bank Channel Capability for H-Tile
Chip-to-Chip & Chip-to-Module Backplane
GX 4 12.5 Gbps N/A
GXT 3 2 28.3 Gbps 28.3 Gbps
Figure 13. Example Combination 3: 2 GXT and 4 GX Channels
Table 7.  Combination 4: 1 GXT and 5 GX Channels
Channel Type Number of Channels per Bank Channel Capability for H-Tile
Chip-to-Chip & Chip-to-Module Backplane
GX 5 12.5 Gbps N/A
GXT 3 1 28.3 Gbps 28.3 Gbps
Figure 14. Example Combination 4: 1 GXT and 5 GX Channels
3 If you use GXT channel data rates, the VCCR_GXB and VCCT_GXB voltages must be set to 1.12 V.
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