High Bandwidth Memory (HBM2) Interface FPGA IP User Guide

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ID 683189
Date 3/29/2024
Public
Document Table of Contents
Document Table of Contents x
1. About the High Bandwidth Memory (HBM2) Interface Intel® FPGA IP 2. Introduction to High Bandwidth Memory 3. Stratix® 10 HBM2 Architecture 4. Creating and Parameterizing the High Bandwidth Memory (HBM2) Interface Intel® FPGA IP 5. Simulating the High Bandwidth Memory (HBM2) Interface Intel® FPGA IP 6. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP Interface 7. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP Controller Performance 8. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP User Guide Archives 9. Document Revision History for High Bandwidth Memory (HBM2) Interface FPGA IP User Guide
1. About the High Bandwidth Memory (HBM2) Interface Intel® FPGA IP x
1.1. Release Information
2. Introduction to High Bandwidth Memory x
2.1. HBM2 in Intel® Stratix® 10 Devices 2.2. HBM2 DRAM Structure 2.3. Stratix® 10 HBM2 Features 2.4. Stratix® 10 HBM2 Controller Features
3. Stratix® 10 HBM2 Architecture x
3.1. Stratix® 10 HBM2 Introduction 3.2. Stratix® 10 UIB Architecture 3.3. Stratix® 10 HBM2 Controller Architecture
3.3. Stratix® 10 HBM2 Controller Architecture x
3.3.1. Stratix® 10 HBM2 Controller Details
4. Creating and Parameterizing the High Bandwidth Memory (HBM2) Interface Intel® FPGA IP x
4.1. Creating an Quartus® Prime Pro Edition Project for High Bandwidth Memory (HBM2) Interface FPGA IP 4.2. Parameterizing the High Bandwidth Memory (HBM2) Interface Intel® FPGA IP 4.3. Pin Planning for the High Bandwidth Memory (HBM2) Interface Intel® FPGA IP
4.2. Parameterizing the High Bandwidth Memory (HBM2) Interface Intel® FPGA IP x
4.2.1. General Parameters for High Bandwidth Memory (HBM2) Interface Intel® FPGA IP 4.2.2. FPGA I/O Parameters for High Bandwidth Memory (HBM2) Interface Intel® FPGA IP 4.2.3. Controller Parameters for High Bandwidth Memory (HBM2) Interface Intel® FPGA IP 4.2.4. Diagnostic Parameters for High Bandwidth Memory (HBM2) Interface Intel® FPGA IP 4.2.5. Example Designs Parameters for High Bandwidth Memory (HBM2) Interface Intel® FPGA IP 4.2.6. Register Map IP-XACT Support for HBM2 IP
5. Simulating the High Bandwidth Memory (HBM2) Interface Intel® FPGA IP x
5.1. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP Example Design 5.2. Simulating High Bandwidth Memory (HBM2) Interface Intel® FPGA IP with ModelSim* and Questa* 5.3. Simulating High Bandwidth Memory (HBM2) Interface Intel® FPGA IP with Synopsys VCS* 5.4. Simulating High Bandwidth Memory (HBM2) Interface Intel® FPGA IP with Riviera-PRO* 5.5. Simulating High Bandwidth Memory (HBM2) Interface Intel® FPGA IP with Cadence Xcelium* Parallel Simulator 5.6. Simulating High Bandwidth Memory (HBM2) Interface Intel® FPGA IP for High Efficiency 5.7. Simulating High Bandwidth Memory (HBM2) Interface IP Instantiated in Your Project
6. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP Interface x
6.1. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP High Level Block Diagram 6.2. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP Controller Interface Signals 6.3. User AXI Interface Timing 6.4. User APB Interface Timing 6.5. User-controlled Accesses to the HBM2 Controller 6.6. Soft AXI Switch
6.2. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP Controller Interface Signals x
6.2.1. Clock Signals 6.2.2. Reset Signals 6.2.3. Calibration Status Signals 6.2.4. Memory Interface Signals 6.2.5. User-interface Signals 6.2.6. AXI User-interface Signals 6.2.7. Sideband APB Interface 6.2.8. Avalon® Memory-Mapped (AVMM) Interface Signals
6.3. User AXI Interface Timing x
6.3.1. AXI Write Transaction 6.3.2. AXI Read Transaction 6.3.3. Improving User Logic to HBM2 Controller AXI Interface Timing
6.4. User APB Interface Timing x
6.4.1. Advanced Peripheral Bus Protocol 6.4.2. APB Interface Timing
6.5. User-controlled Accesses to the HBM2 Controller x
6.5.1. User-controlled Refreshes 6.5.2. Temperature and Calibration Status Readout 6.5.3. Controller Idle State Status 6.5.4. Power Down Status 6.5.5. ECC Error Status 6.5.6. User Interrupt 6.5.7. ECC Error Correction and Detection
6.5.6. User Interrupt x
6.5.6.1. Interrupt Enable and Conditions for Interrupt Generation 6.5.6.2. Interrupt Status 6.5.6.3. Error Valid Status
6.6. Soft AXI Switch x
6.6.1. AXI Switch Selection in HBM2 IP Catalog GUI
7. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP Controller Performance x
7.1. High Bandwidth Memory (HBM2) DRAM Bandwidth 7.2. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP HBM2 IP Efficiency 7.3. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP Latency 7.4. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP Timing 7.5. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP DRAM Temperature Readout
1. About the High Bandwidth Memory (HBM2) Interface Intel® FPGA IP
2. Introduction to High Bandwidth Memory
3. Stratix® 10 HBM2 Architecture
4. Creating and Parameterizing the High Bandwidth Memory (HBM2) Interface Intel® FPGA IP
5. Simulating the High Bandwidth Memory (HBM2) Interface Intel® FPGA IP
6. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP Interface
7. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP Controller Performance
8. High Bandwidth Memory (HBM2) Interface Intel® FPGA IP User Guide Archives
9. Document Revision History for High Bandwidth Memory (HBM2) Interface FPGA IP User Guide

2.3. Stratix® 10 HBM2 Features

Stratix® 10 FPGAs offer the following HBM2 features.
  • Supports one to eight HBM2 channels per HBM2 interface in the Pseudo Channel mode.
  • Each HBM2 channel supports a 128-bit DDR data bus, with optional ECC support.
  • Pseudo Channel mode divides each channel into two individual 64-bit I/O pseudo-channels. The two pseudo-channels operate semi-independently; they share the channel’s row and column command bus as well as CK and CKE inputs, but they decode and execute commands individually. Address BA4 directs commands to either pseudo-channel 0 (BA4 = 0) or pseudo-channel 1 (BA4 = 1), offering unique address space to each pseudo-channel. Pseudo Channel mode requires that the burst length for DRAM transactions is set to 4.
  • Data referenced to strobes RDQS_t / RDQS_c and WDQS_t / WDQS_c, one strobe pair per 32 DQs.
  • Differential clock inputs (CK_t / CK_c). Unterminated data/address/cmd/clk interfaces.
  • DDR commands entered on each positive CK_t and CK_c edge. Row Activate commands require two memory cycles; all other command are single-cycle commands.
  • Supports command, write data and read data parity.
  • Support for bank grouping.
  • Support for data bus inversion.
  • 64-bit data per pseudo-channel. Eight additional data bits are available per pseudo-channel; you can use these data bits for any of the following:
    • ECC. The ECC scheme implemented is single-bit error correction with double-bit error detection (SECDEC). This includes 8 bits of ECC code (also known as syndrome).
    • Data mask (DM). The data mask for masking write data per byte.
    • Can be left unused.
  • I/O voltage of 1.2V and DRAM core voltage of 1.2V.
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