External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP User Guide

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Date 4/03/2023
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Document Table of Contents
Document Table of Contents x
1. About the External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP 2. Intel Agilex® 7 M-Series FPGA EMIF IP – Introduction 3. Intel Agilex® 7 M-Series FPGA EMIF IP – Product Architecture 4. Intel Agilex® 7 M-Series FPGA EMIF IP – End-User Signals 5. Intel Agilex® 7 M-Series FPGA EMIF IP – Simulating Memory IP 6. Intel Agilex 7 M-Series FPGA EMIF IP – DDR4 Support 7. Intel Agilex® 7 M-Series FPGA EMIF IP – DDR5 Support 8. Intel Agilex 7 M-Series FPGA EMIF IP – LPDDR5 Support 9. Intel Agilex® 7 M-Series FPGA EMIF IP – Timing Closure 10. Intel Agilex® 7 M-Series FPGA EMIF IP – Controller Optimization 11. Intel Agilex® 7 M-Series FPGA EMIF IP – Debugging 12. Document Revision History for External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP User Guide
1. About the External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP x
1.1. Release Information
2. Intel Agilex® 7 M-Series FPGA EMIF IP – Introduction x
2.1. Intel Agilex® 7 M-Series EMIF IP Protocol and Feature Support 2.2. Intel Agilex® 7 M-Series EMIF IP Design Flow 2.3. Intel Agilex® 7 M-Series EMIF IP Design Checklist
3. Intel Agilex® 7 M-Series FPGA EMIF IP – Product Architecture x
3.1. Intel Agilex® 7 M-Series EMIF Architecture: Introduction 3.2. Intel Agilex® 7 M-Series EMIF Sequencer 3.3. Intel Agilex® 7 M-Series EMIF Controller
3.1. Intel Agilex® 7 M-Series EMIF Architecture: Introduction x
3.1.1. Intel Agilex® 7 M-Series EMIF Architecture: I/O Subsystem 3.1.2. Intel Agilex® 7 M-Series EMIF Architecture: I/O SSM 3.1.3. Intel Agilex® 7 M-Series EMIF Architecture: I/O Bank 3.1.4. Intel Agilex® 7 M-Series EMIF Architecture: I/O Lane 3.1.5. Intel Agilex® 7 M-Series EMIF Architecture: Input DQS Clock Tree 3.1.6. Intel Agilex® 7 M-Series EMIF Architecture: PHY Clock Tree 3.1.7. Intel Agilex® 7 M-Series EMIF Architecture: PLL Reference Clock Networks 3.1.8. Intel Agilex® 7 M-Series EMIF Architecture: Clock Phase Alignment
3.1.3. Intel Agilex® 7 M-Series EMIF Architecture: I/O Bank x
3.1.3.1. DDR4 Pin Placement 3.1.3.2. DDR5 Pin Placement 3.1.3.3. LPDDR5 Pin Placement 3.1.3.4. I/O Sub-Bank Usage
3.2. Intel Agilex® 7 M-Series EMIF Sequencer x
3.2.1. Intel Agilex® 7 M-Series Mailbox Structure and Register Definitions
3.3. Intel Agilex® 7 M-Series EMIF Controller x
3.3.1. Hard Memory Controller
3.3.1. Hard Memory Controller x
3.3.1.1. Hard Memory Controller Features
4. Intel Agilex® 7 M-Series FPGA EMIF IP – End-User Signals x
4.1. Intel Agilex® 7 M-Series EMIF IP for DDR4 Interfaces 4.2. Intel Agilex® 7 M-Series EMIF IP for DDR5 Interfaces 4.3. Intel Agilex® 7 M-Series EMIF IP for LPDDR5 Interfaces
4.1. Intel Agilex® 7 M-Series EMIF IP for DDR4 Interfaces x
4.1.1. ref_clk for EMIF 4.1.2. core_init_n for EMIF 4.1.3. usr_async_clk for EMIF 4.1.4. usr_clk for EMIF 4.1.5. usr_rst_n for EMIF 4.1.6. s0_axi4 for EMIF 4.1.7. mem for EMIF 4.1.8. oct for EMIF 4.1.9. s0_axil_clk for EMIF 4.1.10. s0_axil_rst_n for EMIF 4.1.11. s0_axil for EMIF
4.2. Intel Agilex® 7 M-Series EMIF IP for DDR5 Interfaces x
4.2.1. ref_clk for EMIF 4.2.2. core_init_n for EMIF 4.2.3. usr_async_clk for EMIF 4.2.4. usr_clk for EMIF 4.2.5. usr_rst_n for EMIF 4.2.6. s0_axi4 for EMIF 4.2.7. mem for EMIF 4.2.8. oct for EMIF 4.2.9. s0_axil_clk for EMIF 4.2.10. s0_axil_rst_n for EMIF 4.2.11. s0_axil for EMIF
4.3. Intel Agilex® 7 M-Series EMIF IP for LPDDR5 Interfaces x
4.3.1. ref_clk for EMIF 4.3.2. core_init_n for EMIF 4.3.3. usr_async_clk for EMIF 4.3.4. usr_clk for EMIF 4.3.5. usr_rst_n for EMIF 4.3.6. s0_axi4 for EMIF 4.3.7. mem for EMIF 4.3.8. oct for EMIF 4.3.9. s0_axil_clk for EMIF 4.3.10. s0_axil_rst_n for EMIF 4.3.11. s0_axil for EMIF
5. Intel Agilex® 7 M-Series FPGA EMIF IP – Simulating Memory IP x
5.1. Simulation Walkthrough
5.1. Simulation Walkthrough x
5.1.1. Calibration 5.1.2. Simulation Scripts 5.1.3. Functional Simulation with Verilog HDL 5.1.4. Simulating the Design Example
6. Intel Agilex 7 M-Series FPGA EMIF IP – DDR4 Support x
6.1. Intel Agilex 7 M-Series FPGA EMIF IP Parameters for DDR4 6.2. Intel Agilex® 7 M-Series FPGA EMIF IP Pin and Resource Planning 6.3. DDR4 Board Design Guidelines
6.1. Intel Agilex 7 M-Series FPGA EMIF IP Parameters for DDR4 x
6.1.1. Intel Agilex 7 M-Series FPGA EMIF Memory Device Description IP (DDR4) Parameter Descriptions 6.1.2. Intel Agilex 7 M-Series FPGA EMIF IP Parameter Descriptions (DDR4)
6.2. Intel Agilex® 7 M-Series FPGA EMIF IP Pin and Resource Planning x
6.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins 6.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources 6.2.3. Pin Guidelines for Intel Agilex® 7 M-Series FPGA EMIF IP 6.2.4. Pin Placements for Intel Agilex® 7 M-Series FPGA DDR4 EMIF IP
6.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins x
6.2.1.1. Estimating Pin Requirements 6.2.1.2. DIMM Options 6.2.1.3. Maximum Number of Interfaces
6.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources x
6.2.2.1. OCT 6.2.2.2. PLL
6.2.4. Pin Placements for Intel Agilex® 7 M-Series FPGA DDR4 EMIF IP x
6.2.4.1. Address and Command Pin Placement for DDR4 6.2.4.2. DDR4 Data Width Mapping 6.2.4.3. General Guidelines 6.2.4.4. x4 DIMM Implementation 6.2.4.5. Specific Pin Connection Requirements 6.2.4.6. Command and Address Signals 6.2.4.7. Clock Signals 6.2.4.8. Data, Data Strobes, DM/DBI, and Optional ECC Signals
6.3. DDR4 Board Design Guidelines x
6.3.1. Terminations for DDR4 with Intel Agilex® 7 M-Series Devices 6.3.2. General Layout Routing Guidelines 6.3.3. Reference Stackup 6.3.4. Intel Agilex® 7 M-Series EMIF-Specific Routing Guidelines for Various DDR4 Topologies 6.3.5. DDR4 Routing Guidelines: Discrete (Component) Topologies
6.3.1. Terminations for DDR4 with Intel Agilex® 7 M-Series Devices x
6.3.1.1. Dynamic On-Chip Termination (OCT) 6.3.1.2. Dynamic On-Die Termination (ODT) in DDR4 6.3.1.3. Choosing Terminations on Intel Agilex® 7 M-Series FPGA Devices 6.3.1.4. On-Chip Termination Recommendations for Intel Agilex® 7 M-Series FPGA Devices
6.3.4. Intel Agilex® 7 M-Series EMIF-Specific Routing Guidelines for Various DDR4 Topologies x
6.3.4.1. One DIMM per Channel (1DPC) for UDIMM, RDIMM, and SODIMM DDR4 Topologies 6.3.4.2. Skew Matching Guidelines for DIMM Configurations 6.3.4.3. Power Delivery Recommendations for the Memory / DIMM Side
6.3.5. DDR4 Routing Guidelines: Discrete (Component) Topologies x
6.3.5.1. Single Rank x 8 Discrete (Component) Topology 6.3.5.2. Single Rank x 16 Discrete (Component) Topology 6.3.5.3. ADDR/CMD Reference Voltage/RESET Signal Routing Guidelines for Single Rank x 8 and Single Rank x 16 Discrete (Component) Topologies 6.3.5.4. Skew Matching Guidelines for DDR4 Discrete Configurations 6.3.5.5. Power Delivery Recommendations for DDR4 Discrete Configurations 6.3.5.6. Intel Agilex® 7 M-Series EMIF Pin Swapping Guidelines
6.3.5.6. Intel Agilex® 7 M-Series EMIF Pin Swapping Guidelines x
6.3.5.6.1. DDR4 Byte Lane Swapping 6.3.5.6.2. DDR4 Address and Command and CLK Lane 6.3.5.6.3. DDR4 Interface x8 Data Lane 6.3.5.6.4. DDR4 Interface x4 Data Lane
7. Intel Agilex® 7 M-Series FPGA EMIF IP – DDR5 Support x
7.1. Intel Agilex 7 M-Series FPGA EMIF IP Parameters for DDR5 7.2. Intel Agilex® 7 M-Series FPGA EMIF IP Pin and Resource Planning
7.1. Intel Agilex 7 M-Series FPGA EMIF IP Parameters for DDR5 x
7.1.1. Intel Agilex 7 M-Series FPGA EMIF Memory Device Description IP (DDR5) Parameter Descriptions 7.1.2. Intel Agilex 7 M-Series FPGA EMIF IP Parameter Descriptions (DDR5)
7.2. Intel Agilex® 7 M-Series FPGA EMIF IP Pin and Resource Planning x
7.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins 7.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources 7.2.3. Pin Guidelines for Intel Agilex® 7 M-Series FPGA EMIF IP
7.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins x
7.2.1.1. Estimating Pin Requirements 7.2.1.2. DIMM Options 7.2.1.3. Maximum Number of Interfaces
7.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources x
7.2.2.1. OCT 7.2.2.2. PLL
7.2.3. Pin Guidelines for Intel Agilex® 7 M-Series FPGA EMIF IP x
7.2.3.1. General Guidelines 7.2.3.2. x4 DIMM Implementation 7.2.3.3. Specific Pin Connection Requirements 7.2.3.4. Command and Address Signals 7.2.3.5. Clock Signals 7.2.3.6. Data, Data Strobes, DM/DBI, and Optional ECC Signals
8. Intel Agilex 7 M-Series FPGA EMIF IP – LPDDR5 Support x
8.1. Intel Agilex 7 M-Series FPGA EMIF IP Parameters for LPDDR5 8.2. Intel Agilex® 7 M-Series FPGA EMIF IP Pin and Resource Planning
8.1. Intel Agilex 7 M-Series FPGA EMIF IP Parameters for LPDDR5 x
8.1.1. Intel Agilex 7 M-Series FPGA EMIF Memory Device Description IP (LPDDR5) Parameter Descriptions 8.1.2. Intel Agilex 7 M-Series FPGA External Memory Interfaces (EMIF) IP Parameter Descriptions for LPDDR5
8.2. Intel Agilex® 7 M-Series FPGA EMIF IP Pin and Resource Planning x
8.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins 8.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources 8.2.3. Pin Guidelines for Intel Agilex® 7 M-Series FPGA EMIF IP
8.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins x
8.2.1.1. Estimating Pin Requirements 8.2.1.2. DIMM Options 8.2.1.3. Maximum Number of Interfaces
8.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources x
8.2.2.1. OCT 8.2.2.2. PLL
8.2.3. Pin Guidelines for Intel Agilex® 7 M-Series FPGA EMIF IP x
8.2.3.1. General Guidelines 8.2.3.2. Specific Pin Connection Requirements 8.2.3.3. Command and Address Signals 8.2.3.4. Clock Signals
9. Intel Agilex® 7 M-Series FPGA EMIF IP – Timing Closure x
9.1. Timing Closure 9.2. Optimizing Timing
9.1. Timing Closure x
9.1.1. Timing Analysis
9.1.1. Timing Analysis x
9.1.1.1. PHY or Core
10. Intel Agilex® 7 M-Series FPGA EMIF IP – Controller Optimization x
10.1. Interface Standard 10.2. Bank Management Efficiency 10.3. Data Transfer 10.4. Improving Controller Efficiency
10.4. Improving Controller Efficiency x
10.4.1. Frequency of Operation 10.4.2. Series of Reads or Writes
11. Intel Agilex® 7 M-Series FPGA EMIF IP – Debugging x
11.1. Interface Configuration Performance Issues 11.2. Functional Issue Evaluation 11.3. Timing Issue Characteristics 11.4. Verifying Memory IP Using the Signal Tap Logic Analyzer 11.5. Generating Traffic with the Test Engine IP
11.1. Interface Configuration Performance Issues x
11.1.1. Interface Configuration Bottleneck and Efficiency Issues
11.2. Functional Issue Evaluation x
11.2.1. Intel® IP Memory Model 11.2.2. Vendor Memory Model 11.2.3. Transcript Window Messages
11.3. Timing Issue Characteristics x
11.3.1. Evaluating FPGA Timing Issues 11.3.2. Evaluating External Memory Interface Timing Issues
1. About the External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP
2. Intel Agilex® 7 M-Series FPGA EMIF IP – Introduction
3. Intel Agilex® 7 M-Series FPGA EMIF IP – Product Architecture
4. Intel Agilex® 7 M-Series FPGA EMIF IP – End-User Signals
5. Intel Agilex® 7 M-Series FPGA EMIF IP – Simulating Memory IP
6. Intel Agilex 7 M-Series FPGA EMIF IP – DDR4 Support
7. Intel Agilex® 7 M-Series FPGA EMIF IP – DDR5 Support
8. Intel Agilex 7 M-Series FPGA EMIF IP – LPDDR5 Support
9. Intel Agilex® 7 M-Series FPGA EMIF IP – Timing Closure
10. Intel Agilex® 7 M-Series FPGA EMIF IP – Controller Optimization
11. Intel Agilex® 7 M-Series FPGA EMIF IP – Debugging
12. Document Revision History for External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP User Guide

6.1.2. Intel Agilex 7 M-Series FPGA EMIF IP Parameter Descriptions (DDR4)

Table 54.  Group: General IP Parameters / High-Level Parameters
Display Name Description
Technology Generation Denotes the specific memory technology generation to be used (Identifier: MEM_TECHNOLOGY)
Memory Format Specifies the packaging format of the memory device (Identifier: MEM_FORMAT)
Memory Device Topology Topology used by memory device (Identifier: MEM_TOPOLOGY)
Memory Ranks Total number of physical ranks in the interface. Intel Agilex® 7 M-Series devices support up to 2 ranks. (Identifier: MEM_NUM_RANKS)
Device DQ Width If the device is a DIMM: Specifies the full DQ width of the DIMM. If the interface is composed of discrete components: Specifies the DQ width of each discrete component. (Identifier: MEM_DEVICE_DQ_WIDTH)
Number of components per rank Number of components per rank. If each component contains more than one rank, then set this parameter to 1. (Identifier: MEM_COMPS_PER_RANK)
ECC Mode Specifies the type of ECC (if any) and the required number of side-band bits that will be used by this EMIF instance. While not all required side-band bits necessarily carry ECC bits, all need to be connected to the memory device. If enabling ECC requires more side-band bits than necessary ECC bits, then ECC bits are transmitted on the least significant side-band bits. Note: This parameter can be auto-computed. (Identifier: CTRL_ECC_MODE)
Total DQ Width

(Derived Parameter) This will be the width (in bits) of the mem_dq port on the memory interface.

For a component interface, it is calculated based on: (MEM_COMPS_PER_RANK * MEM_DEVICE_DQ_WIDTH + (8 bits if Side-band ECC is enabled, or 8 bits if AXI4 User Data is enabled in fabric modes, or 4 bits if AXI4 User Data is enabled in NoC mode)) * MEM_NUM_CHANNELS

For a DIMM-based interface, it is just MEM_DEVICE_DQ_WIDTH + (8 bits if side-band ECC is enabled, or 8 bits if AXI4 User Data is enabled in fabric modes, or 4 bits if AXI4 User Data is enabled in NoC mode) * MEM_NUM_CHANNELS. (Identifier: MEM_TOTAL_DQ_WIDTH)

Alert_N Pin Placement Specifies the AC lane to place Alert_N pin in. This parameter is only required for DDR4. (Identifier: PHY_ALERT_N_PLACEMENT)
Minimum number of AC lanes for DDR4 Specifies the minimum number of AC lanes required for the memory interface. Only applicable for DDR4. (Identifier: USER_MIN_NUM_AC_LANES)
Memory Clock Frequency Specifies the operating frequency of the memory interface in MHz. If you change the memory frequency, you must select a matching Preset from the dropdown (or create a custom one), to update all the timing parameters. Note: This parameter can be auto-computed. (Identifier: PHY_MEMCLK_FREQ_MHZ)
Instance ID Instance ID of the EMIF IP. EMIF in the same bank, or connected to related user logic (e.g. to the same INIU), should have unique IDs in order to distinguish them when using the side-band interface. Valid values are 0-6. (Identifier: INSTANCE_ID)
Table 55.  Group: General IP Parameters / Memory Device Preset Selection
Display Name Description
Use Memory Device Preset from file Specifies whether MEM_PRESET_ID will be a value from Quartus (if false), or a value from a custom preset file path (if true) (Identifier: MEM_PRESET_FILE_EN)
Memory Preset Custom File Path Path to a .qprs file on the users disk. (Identifier: MEM_PRESET_FILE_QPRS)
Memory Preset The name of a preset that the user would like to load, describing the memory device that this emif will be targeting. (Identifier: MEM_PRESET_ID)
Table 56.  Group: General IP Parameters / Advanced Parameters / PHY / Topology
Display Name Description
Use NOC Specifies whether we are using the NOC or bypassing it (Identifier: PHY_NOC_EN)
Asynchronous Enable Specifies whether the user logic is clocked based on the clock provided by the IP (Sync), or by a separate user clock (Async). If true - async mode is used, if false - sync mode is used. (Identifier: PHY_ASYNC_EN)
AC Placement Indicates location on the device where the interface will reside (specifically, the location of the AC lanes in terms IO BANK and TOP vs BOT part of the IO BANK). Legal ranges are derived from device floorplan. By default (value=AUTO), the most optimal location is selected (to maximize available frequency and Data width). Note: This parameter can be auto-computed. (Identifier: PHY_AC_PLACEMENT)
PLL Reference Clock Frequency Specifies what PLL reference clock frequency the user will supply. It is recommended to use the fastest possible PLL reference clock frequency because it leads to better jitter performance. Note: This parameter can be auto-computed. (Identifier: PHY_REFCLK_FREQ_MHZ)
Table 57.  Group: General IP Parameters / Advanced Parameters / Analog Properties / Termination (FPGA-side)
Display Name Description
Host Address/Command Output Drive Strength This parameter allows you to change the output on chip termination settings for the selected I/O standard on the Address/Command Pins. Perform board simulation with IBIS models to determine the best settings for your design. Note: This parameter can be auto-computed. (Identifier: R_S_FPGA_AC_OUTPUT_OHM)
Host PLL Reference Clock Input Termination This parameter allows you to change the input on chip termination settings for the selected I/O standard on the CK Pins. Perform board simulation with IBIS models to determine the best settings for your design. Note: This parameter can be auto-computed. (Identifier: R_T_FPGA_REFCLK_INPUT_OHM)
Host CK Output Drive Strength This parameter allows you to change the output on chip termination settings for the selected I/O standard on the CK Pins. Perform board simulation with IBIS models to determine the best settings for your design. Note: This parameter can be auto-computed. (Identifier: R_S_FPGA_CK_OUTPUT_OHM)
Host DQ Input Termination This parameter allows you to change the input on chip termination settings for the selected I/O standard on the DQ Pins. Perform board simulation with IBIS models to determine the best settings for your design. Note: This parameter can be auto-computed. (Identifier: R_T_FPGA_DQ_INPUT_OHM)
Host DQ Output Drive Strength This parameter allows you to change the output on chip termination settings for the selected I/O standard on the DQ Pins. Perform board simulation with IBIS models to determine the best settings for your design. Note: This parameter can be auto-computed. (Identifier: R_S_FPGA_DQ_OUTPUT_OHM)
Table 58.  Group: General IP Parameters / Advanced Parameters / AXI Settings / AXI Interface Settings
Display Name Description
AXI-Lite Port Access Mode Specifies whether the AXI-Lite port is connected to the fabric, the NOC, or disabled. Note: This parameter can be auto-computed. (Identifier: AXI_SIDEBAND_ACCESS_MODE)
Table 59.  Group: General IP Parameters / Advanced Parameters / Advanced Parameters / Additional String Parameters
Display name Description
User Extra Parameters Semi-colon separated list of key/value pairs of extra parameters. (Identifier: USER_EXTRA_PARAMETERS)
Table 60.  Group: Example Design / Example Design
Display Name Description
HDL Selection This option lets you choose the format of HDL in which generated simulation and synthesis files are created. You can select either Verilog or VHDL. (Identifier: EX_DESIGN_HDL_FORMAT)
Synthesis Generate Synthesis Example Design (Identifier: EX_DESIGN_GEN_SYNTH)
Simulation Generate Simulation Example Design (Identifier: EX_DESIGN_GEN_SIM)
NOC Refclk Freq NOC Refclk Freq for the NOC control IP Note: This parameter can be auto-computed. (Identifier: EX_DESIGN_NOC_REFCLK_FREQ_MHZ)
Hydra Remote Access Specifies whether the Hydra control and status registers are accessible via JTAG, exported to the fabric, or just disabled. (Identifier: EX_DESIGN_HYDRA_REMOTE)
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